Polyaspartic polyurea electronic potting compound
A potting compound for electronic components, designed for electrical insulation and temperature resistance to protect circuit boards from environmental exposure.
- Product name:
- Polyaspartic polyurea electronic potting compound
- Product category:
- A glue.
Core characteristics
- Good insulation.
- High- and low-temperature resistance
- For electronic components
Specifications
Technical documents and conditions of use
See the technical documents below for specification sources and conditions. Verify the model and document version before application. Specification sources
A system application handbook is available; an individual TDS or SDS for this product has not been supplied. Use the handbook for system selection only. Confirm the specification, film thickness and acceptance criteria with the technical team for the exact model and service conditions.
Check performance and service-life statements against the applicable reports, specimen preparation, test standards and service conditions. Unverified service-life figures are not durability guarantees; site photos do not replace film-thickness measurements or project acceptance records.
| Parameter | Value / unit / conditions |
|---|---|
| Viscosity at 25°C | 1000-1500 mPa·s (25℃) |
| Solids content | ≥98% |
| Tensile strength | ≥10 MPa |
| Elongation at break | ≥180% |
| Weather resistance | Temperature-- 40℃ ~150℃ |
Applications
Application area: electronic refilling, circuit board protection, LED sealing
Key notes
The above parameters are typical performance ranges, based on products TDS/SDS, batch testing reports and actual performance. Access to corresponding products TDS/SDS, samples and construction proposals.
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