Polyaspartic polyurea electronic potting compound
A potting compound for electronic components, designed for electrical insulation and temperature resistance to protect circuit boards from environmental exposure.
- Product name:
- Polyaspartic polyurea electronic potting compound
- Product category:
- Adhesives and joint-filling materials
Close-up of potting material being poured onto circuit-board components
Key features
- Good insulation.
- High- and low-temperature resistance
- For electronic components
Specifications
Technical documents and conditions of use
See the technical documents below for specification sources and conditions. Verify the exact grade and document version before application. Specification sources
A system application handbook is available; an individual TDS or SDS for this product has not been supplied. Use the handbook for system selection only. Confirm the specification, film thickness and acceptance criteria with the technical team for the exact model and service conditions.
Verify performance and service-life statements against the relevant reports, specimen preparation, test standards and service conditions. Service-life figures without supporting reports are not durability guarantees; site photographs do not replace film-thickness testing or project acceptance records.
| Parameter | Value / unit / conditions |
|---|---|
| Viscosity at 25°C | 1000-1500 mPa·s (25℃) |
| Solids content | ≥98% |
| Tensile strength | ≥10 MPa |
| Elongation at break | ≥180% |
| Weather resistance | Temperature-- 40℃ ~150℃ |
Applications
Application area: electronic refilling, circuit board protection, LED sealing
Key notes
These parameters represent typical performance ranges. Follow the product TDS/SDS, batch test report and actual service conditions. Contact us for the relevant documents, samples and application recommendations.
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